Triple S. provides precision and productivityfor a processing agenda compatible to all workpiece variations. The abundance ofapplications includes prime silicon wafers, magnetic disks of all materials,quartz wafers, ceramics etc. TripleS  has accumulated the most extensivematerial process know-how from all industries.

We are able to achieve superior flatness,parallelism and surface finish with our unique compact and low heightstructure. This large size workpiece system incorporates decades ofproduction experience for ease of operation and low maintenance for the lowestoperating cost.

The 16B DS3M4W system is a general-purpose double-sided machine with a carrier size of 16 inches. As a semi-medium size system, the 16B machines are capable of processing a wide variety of small, thin workpieces. The 16B is an advanced abrasive platform capable of achieving stable parallelism and flatness for small, thin, and brittle workpieces.